4600 Automated BondTester
Improve reliability and throughput while reducing human influence.
Description
The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.
Applications:
Paragon™ – Your automation partner
- Automation assisted GUI
- Build in check list & help
- Multi window views
- Schematic virtual images displayed
Import maps or create your own
- Import wafer map file SINF / G85 / Klarf (AOI) / New Format
- Wire pull and ball shear pattern displays
- Colour gradients indicate different heights
- Inter-die wire corrections
Remove uncertainty – camera assisted programming
- Ultimate accuracy using on-board cameras
- Both high resolution and field of view cameras as standard
- Fiducial images for alignment
Image every failure mode – even with extreme height variations
- Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus
- Automatically return to the failure site to record an image
- Assists with failure mode analysis
- Comes as standard with every 4600 Bondtester
Useful documents
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