4600-W Automated BondTester
Improve reliability and throughput while reducing human influence.
Description
The 4600-W Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.
Load large batches of samples and benefit from robotic handling to load, align and transfer each device to the Bondtester.
Repeatable Results Every Time
Our linear encoder stages with 100nm resolution ensure you get to the right location every time.
Improve Tool ROI
Start the test then attend to other work while the system automatically completes large batch testing. Tests can be controlled and data exported using SECS/GEM protocols integrated with your factory.
Data is Everything
Achieve maximum data integrity with multiple on-board cameras to recognize fiducial markings and automatically capture failure mode images.
Ultimate Product Safety
Using robotic handling with vacuum you can safely load and unload your product and protect from handling errors and damage. There is no risk of losing a batch and no need to ever repeat a test
Remove the Expert
Paragon™ software is easy to use and simple to set-up for a new product, meaning you don;t need to rely on expert operators as a single point of failure. A single operator can manage multiple systems if required.
Maximum UPH
Fully integrated cassette handling and mapping capabilities combined with device mapping delivers maximum efficiency. Achieve consistent UPH results 24/7 regardless of who is operating the Bondtester.
Applications:
Automatic testing for leadframe and wafers (<200mm)
Paragon™ – Your automation partner
- Automation assisted GUI
- Build in check list & help
- Multi window views
- Schematic virtual images displayed
Import maps or create your own
- Import wafer map file SINF / G85 / Klarf (AOI) / New Format
- Wire pull and ball shear pattern displays
- Colour gradients indicate different heights
- Inter-die wire corrections
Remove uncertainty – camera assisted programming
- Ultimate accuracy using on-board cameras
- Both high resolution and field of view cameras as standard
- Fiducial images for alignment
Image every failure mode – even with extreme height variations
- Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus
- Automatically return to the failure site to record an image
- Assists with failure mode analysis
- Comes as standard with every 4600 Bondtester
