Paragon™ Materials
Analyze. Investigate. Report.
Description
It’s an exciting time for the micro-electronics industry as device density continues to increase, which brings new challenges for interconnect evaluation. The increase in flip chip devices and the emergence of copper pillars and die stacking represents new challenges for the testing of these materials.
Being in touch with the industry changes, Nordson DAGE has developed Paragon™ Materials, an innovative software platform designed specifically to perform and interpret a range of materials tests such as creep, torsion, fatigue, compression and bend.
When it comes to analyzing a new device or component, accuracy is everything. This new suite of software is dedicated to micro-materials testing which guides you through even the most difficult of failure analysis tests.
Unparalleled test capability.
Paragon Materials is capable of performing a range of complex material tests, including bend, compress, peel, creep, torque, see below. Each is uniquely designed to find a particular failure mode depending on the type of material or device being analysed.
Nordson DAGE has a range of test jigs and work holders which are specifically designed for micro-materials testing. These are all fully compatible with our range of BondTesters and with Paragon Materials.
Analyze every component.
- Watch failure occur with live plotting of data, pause and alter tests if necessary
- Perform difficult and non-standard test procedures with custom routines
- See trends and grouped sample spreads automatically across multiple sample types
- Lifetime-testing: perform long term tests over time or number of cycles
- In-built failure analysis and statistical functions as standard
Accuracy is paramount.
Every device has a unique set of dimensions, and these dimensions are critical to understand forces such as stress and strain. In Paragon Materials we take your device dimensions into account by allowing you to define each parameter as accurately as possible.
